Method of accessing matrix data with address translation circuit that enables quick serial access in row or column directions

ABSTRACT

A method of accessing matrix data of a semiconductor memory having memory banks. The memory banks each having memory cells arranged in X and Y directions, a Y decoder for selecting Y-direction addresses of the memory cells and an X decoder for selecting X-direction addresses of the memory cells, predicated on the memory banks being operable independently. Items of data specified by a specified number of continuous X addresses and having the same Y addresses are successively written into or read from the memory cells arranged in the X direction, which are specified by X addresses corresponding to 1+knth in one of the banks. After all data have been written into or read from the specified memory cells, corresponding data are successively written into or read from the memory cells specified by X addresses corresponding to 2+knth in another one of the banks.

BACKGROUND OF THE INVENTION

This invention relates to a semiconductor memory device and a method ofreading data from and writing data into the semiconductor memory device,and particularly to a memory device of a type wherein a method ofreading data therefrom and writing data therein is contrived.

DESCRIPTION OF THE RELATED ART

One arbitrary screen of a CRT used for a general TV or panel or a PC(Personal Computer) is made up of a plurality of lines scanned over afluorescent screen of a Braun tube in a transverse direction thereof. Inthe conventional system, one line comprises image information units(hereinafter called “pixels”) of about 900 dots to 1000 dots. The numberof lines constituting one screen commonly ranges from about 500 to 600.When a memory is used in a system (TV, CRT or the like) which handlesimage information, it is necessary to access line information at highspeed. On the other hand, the line information is easy to treat withbecause of serial addresses to be incremented. Therefore, when oneattempts to handle the line information in a commonly general-purposeDRAM (Dynamic Random Access Memory), a page mode for accessing a seriesof pieces of memory information selected by an arbitrary word line athigh speed is often used.

Memories used except for the general-purpose DRAM include a fieldmemory, a dedicated memory called “frame memory.” These memories arecapable of connecting a data register corresponding to one page to itscorresponding bit line pair of the DRAM, transferring a series of pluralmemory information selected by a corresponding word line of the DRAM totheir corresponding data register (or transferring write-completed dataregister information to a series of plurality of memories selected bytheir corresponding word lines) and providing a quick serial access.Thus, even the field memory or the frame memory serially accessesinformation (i.e., page information corresponding to one row) coupled tothe same word line in a page mode as in the case of the aforementionedDRAM. Namely, a page mode. (corresponding to a page mode (Enhanced DataOut: EDO) faster in speed in the recent DRAM) has heretofore been usedin an image processing system using a TV and a CRT when used to accessthe line information.

The conventional page mode is used for various purposes such as a scanconverter requiring an access (i.e., a serial access in a columndirection) in a vertical direction, a noise filter, a matrixcalculation, etc. In the conventional memory, however, the serial accessin the column direction cannot be structurally performed at high speedalthough the serial access in the row direction can be executed at highspeed. In the general-purpose DRAM, for example, an access clockfrequency ranges from 15 ns to 20 ns upon an EDO mode corresponding tothe present highest speed serial access mode (page access mode).However, since time is required between the rise to fall of a word linewhen it is desired to perform the serial access in the column direction,the access clock frequency results in a range of 120 ns to 150 ns.

A synchronous DRAM (or SDRAM), which starts to come into wide userecently, mostly takes a configuration in which memory units called“separately-accessible banks” are provided in plural form. A two-bankconfiguration is commonly used for the synchronous DRAM. Data on wordlines (i.e., rows different from each other) different from each otherevery serial bit in a row direction can be taken out by using the twobanks. However, even the memory having the two-bank configuration cannotobtain serial access to different word line information every bit. Sincea succession of page access in a row direction is basically defined as abasic operation even in the case of the field memory used as aTV-dedicated memory, a high-speed serial access in a column directioncannot be implemented.

Thus, a plurality of line memories are electrically connected to amemory to realize a serial access in a column direction in anactually-available system. Namely, a problem arises in that attachedparts called the line memories are needed and thereby the system willlead to an increase in cost.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a memory deviceallowing only memories capable of providing quick serial access in a rowdirection to obtain quick serial access in a column direction withouthaving to use other attached parts, and a method of writing data intoand reading data from the memory device.

In the present invention, memory banks each having memory cells arrangedin an X and a Y directions, Y decoder for selecting Y-directionaddresses of the memory cells and X decoder for selecting X-directionaddresses of the memory cells are predicated on a memory having n (wheren: natural numbers) memory banks operable independent from one another.

Items of data specified by a (where a: natural numbers) continuous Xaddresses and having the same Y addresses are successively written intoor read from the memory cells arranged in the X direction, which arespecified by X addresses corresponding to 1+knth (where k=0, 1, 2, . . .) in one of the banks. After all the data have been written into or readfrom the specified memory cells, the corresponding data are successivelywritten into or read from the memory cells specified by X addressescorresponding to 2+knth (where k=0, 1, 2, . . . ) in anther one of thebanks.

Typical ones of various inventions of the present application have beenshown in brief. However, the various inventions of the presentapplication and specific configurations of these inventions will beunderstood from the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming the subject matter which is regarded as theinvention, it is believed that the invention, the objects and featuresof the invention and further objects, features and advantages thereofwill be better understood from the following description taken inconnection with the accompanying drawings in which:

FIG. 1 is a diagram showing a memory plane of a memory having a memoryarray comprised of two banks;

FIG. 2 is a diagram showing a memory comprised of a collection of memoryunits selected by X addresses of X=0 through N−1 and Y addresses of Y=0through M−1;

FIG. 3 is a diagram showing memory units collected or compiled byadjoining k in an X direction;

FIG. 4 is a diagram showing an access to the line of X=0 in the addressmap of the memory shown in FIG. 2;

FIG. 5 is a diagram showing an access to a line of X=k−1 in the addressmap of the memory shown in FIG. 2;

FIG. 6 is a diagram showing an access to a line of X=k in the addressmap of the memory shown in FIG. 2

FIG. 7 is a diagram showing an order of a serial access in a columndirection of Y=q in the address map of the memory shown in FIG. 2;

FIG. 8 is a diagram showing a memory map having a capacity of 512 bits;

FIGS. 9 through 12 are diagrams showing serial accesses in the rowdirection in different locations to be accessed;

FIG. 13 is a diagram showing an example of a line access of X=0 to X=15in FIG. 8 at Y=0 as an example of the serial access in the columndirection;

FIG. 14 is a circuit diagram showing a first embodiment of thesemiconductor memory device according to the present invention;

FIG. 15 is a diagram describing the operation of the circuit of thefirst embodiment;

FIG. 16 is a circuit diagram showing an address translator on theassumption that the configuration of each individual bank employed inthe first embodiment;

FIG. 17 is a circuit diagram showing a second embodiment of thesemiconductor memory device according to the present invention;

FIG. 18 is a circuit diagram collectively showing the address translatorswitching circuit and the address translator employed in the secondembodiment;

FIG. 19 is a circuit diagram showing a third embodiment of asemiconductor memory device according to the present invention;

FIG. 20 is a circuit diagram showing a special serial Y addressgenerator employed in the third embodiment;

FIG. 21 is a timing chart for describing the operation of the specialserial Y address generator;

FIG. 22 is a circuit diagram showing a fourth embodiment of asemiconductor memory device according to the present invention;

FIG. 23 is a diagram showing a memory map having a capacity of 512 bits;

FIG. 24 shows the order of serially accessing bits on a line of X=0 inthe address map of the memory shown in FIG. 23;

FIG. 25 shows the order of serially accessing bits on a line of X=4 inthe address map of the memory shown in FIG. 23; and

FIG. 26 is a diagram showing the method according to the secondembodiment of the present invention as an example of 4×4 blocks.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A background part of the present invention will be described before thedescription of preferred embodiments.

Any of motion pictures and freeze-frame pictures on a TV screen and a PCscreen is basically made up of a sequence of still-frame screens. Onescreen thereof is called “frame.” A sequence of image bit informationcorresponds to horizontal-direction scanning lines. One frame is made upof a set or collection of the lines. When physical addresses for amemory and a TV screen (or PC screen) are placed in a one-to-onecorrespondence with each other, a system can be easily designed. Here,the physical addresses for the memory and the TV screen (or PC screen)are considered to be in the one-to-one correspondence with each other(the correspondence of addresses and memory units are considered to beas the correspondence between image dots on the TV screen or PC screenand addresses).

FIG. 2 is a diagram showing a memory comprised of a collection of memoryunits selected by X addresses of X=0 through N−1 and Y addresses of Y=0through M−1. In the subsequent description, the memory shown in FIG. 2will be considered as an illustrative example. Incidentally, informationstored in a memory unit selected by an address (Xi, Yj) will be definedas D(Xi, Yj).

Since the line scanning is normally easy to correspond to a memory'spage mode access, the direction of each line corresponds to an Xdirection (row direction) of the memory and line bit addresses arerespectively set by Y addresses. Namely, line addresses correspond tothe X addresses respectively and addresses for respective bits in linesare equivalent to the Y addresses (i.e., it is to be noted that X and Yof a memory and an image are opposed to each other for a physicalimage). A continuous serial data access to the number of bits(equivalent to the number of bits corresponding to one page)corresponding to one row of an ordinary general-purpose memory or abovecannot be made to the ordinary general-purpose memory. This access canbe made to a memory having a memory array comprised of a plurality ofbanks, which is called “SDRAM or field memory (or frame memory)”. Thisis because if there are two banks or more, an access to the next pagecan be prepared during a data access corresponding to one page by way ofbackground. However, a high-speed serial access in a column directioncannot be performed as described previously.

In the present invention, a memory comprised of a plurality of banksutilizes bank interleaving and applies an ability to obtain a high-speedserial access to continuous address bits on different rows (word lines)to thereby operate write addresses. As a result, the continuoushigh-speed serial access in the column direction can be performed by thememory.

In the present invention, the rearrangement or sorting of addresses onan actual memory device having a plurality of banks allows aconventionally-impracticable high-speed serial page access in the columndirection to image data or the like (on a two-dimensional plane)specified by the conventional X and Y addresses as well as theconventional high-speed serial page access thereto in the row direction.A method of implementing a high-speed serial data access by an SDRAMhaving two banks will be explained here with reference to FIG. 2.

In the TV screen and the PC's CRT screen as described previously, the Xaddresses correspond to the line addresses and the Y addressescorrespond to the line bit addresses, respectively. FIG. 2 may beconsidered to be one wherein the screen is shifted by 90 degrees. Therelationship between the memory units and the addresses shown in FIG. 2remains unchanged. As shown in FIG. 3, Y addresses are constant andmemory units are collected or compiled by adjoining k (where k:arbitrary integers and will be omitted subsequently) in an X direction.As a result, compiled small collections or sets will be defined as B(i,j) (where i and j: arbitrary integers and will be omitted subsequently).Thus, the X direction is divided into (N−1)/k. Now consider where when iare keep constant, sets of B(i, j) at the time that j are odd, aredefined as La(i) and sets at the time that j are even, are defined asLb(i) in FIG. 3. When j of B(i, j) are even, sets of B(i, j) are shadedand the sets remain surrounded by frames when j of B(i, j) are odd,respectively as shown in FIG. 3. Thus, La(i) correspond to shaded setsof B(i, j) at the time that i are constant, whereas Lb(i) correspond toframe-surrounded sets of B(i, j) at the time that i are constant. Forexample, the sum of La(0) and Lb(0) is equivalent to a set of memoryunits having addresses of Y=0.

FIG. 1 shows a memory plane of a memory having a memory array comprisedof two banks. The small sets B(i, j) of the memory units shown in FIG. 3are re-arranged in a bank-0 and a bank-1 as shown in FIG. 1. La(i) andLb(i) after the re-arrangement of B(i, j) are arranged as shown inFIG. 1. B(i, j) originally correspond to k-bit information continuous inthe X direction. However, the arrangement of B(i, j) in the Y directionis a large feature.

In FIG. 1, the numbers of La(i) and Lb(i) are respectively arranged as qin the Y direction. Namely, since the maximum addresses of the bank-0and the bank-1 in the Y direction are respectively M−1, B(i, j) providedby k bits in the Y direction are arranged as q=(M−1)/k in a pagedirection. As also shown in FIG. 1, La(0) through La(q−1) are arrangedin a first row in the Y direction of the bank-0, and La(q) through La(2q−1) are arranged in a second row of the bank-1 (it is a key point thatthey are not arranged in the bank-0 identical to La(0) through La(q−1)).Similarly, La(2 q) through La(3 q−1) are arranged in a third row of thebank-0. On the other hand, Lb(0) through Lb(q−1) are arranged in a firstrow of the bank-1 and Lb(2 q−1) is arranged in a second row of thebank-0. Similarly, Lb(2 q) through Lb(3 q−1) are arranged in a third rowof the bank-1.

With such regularity, the memory information and the addresses arere-arranged in the form of La(i) and Lb(i) as shown in FIG. 1 (i.e.,D(i, j) shown in FIG. 2 are written into the memory having the two-bankconfiguration in accordance with FIG. 1). As a result, a high-speedserial access in a column direction can be made as well as a high-speedserial access in a row direction.

A method of writing data into a memory according to a method employed ina first embodiment of the present invention and a method of reading sametherefrom will next be explained. A description will be made of anaccessing method at the time that a relationship of position between theaddresses and the memory shown in FIG. 2 is re-arranged for the memoryhaving the two-bank configuration according to the method of the presentinvention as shown in FIG. 1 for convenience of illustration.

1) Description of High-Speed Serial Access in Row Direction:

1-a) Description of Writing Method:

The X and Y address and memory information shown in FIG. 2 will beexplained in parts as three cases: 1-a-1): where a line of X=0 in theaddress map of the memory shown in FIG. 2 is serially accessed from Y=0,1-a-2): where a line of X=k−1 in the address map of the memory shown inFIG. 2 is serially accessed from Y=0, and 1-a-3): where a line of x=k inthe address map of the memory shown in FIG. 2 is serially accessed fromY=0.

1-a-1) Description of an Access to the Line of X=0 in the Address Map ofthe Memory Shown in FIG. 2:

As shown in FIG. 4, D(0, 0) is first written into the leading bit inB(0, 0) of La(0). D(0, 1) is secondly written into the leading bit inB(1, 0) of La(1). Further, D(0, 2) is thirdly written into the leadingbit in B(2, 0) of La(2). The same operation as described above isrepeated and thereafter D(0, q−1) is written into the leading bit inB(q−1,0) of La(q−1) as the qth. Thus, the serial bits on the line of X=0in the address map of the memory shown in FIG. 1 are written by q bits.

While the write operation is being performed at the above bank-0, thebank-1 is ready for its writing. Getting ready for the writing includesprecharging one of the bit lines of the bank-1.

Next, D(0, q) is written into the leading bit of B(q, 0) of La(q) in thebank-1 as the q+1th. The q+2th writing is as follows: D(0, q+1) iswritten into the leading bit of B(q+1, 0) of La(q+1). The same operationas described above is repeated and thereafter D(0, 2 q−1) is writteninto the leading bit of B(2 q−1, 0) of La(2 q−1) as the 2 qth. Asdescribed above, serial bits on the line of X=0 in the address map ofthe memory shown in FIG. 1 are further written by q bits.

While the write operation at the above bank-1 is being performed, thebank-0 is ready for its writing.

As described in the write operations at the bank-0 and bank-1, theiroperations are further continuously performed up to La(M−1) as indicatedby arrows in FIG. 4. It is thus possible to write the serial bits on theline of X=0 in the address map of the memory shown in FIG. 2 at highspeed (provide a page access in the row direction).

While the writing of serial bits on a line of X=1 in the address map ofthe memory shown in FIG. 2 is performed in a manner similar to the aboveoperation, the present bit writing is different from the above writingin that items of data are written into second bits of B(r, 1) (where r:arbitrary integers). The subsequent processing is performed in the samemanner as described above up to kth bits. However, a description will bemade of X=k−1 indicative of the final bit for reference purposes.

1-a-2) Description of an Access to a Line of X=k−1 in the Address Map ofthe Memory Shown in FIG. 2:

As shown in FIG. 5, D(k−1, 0) is first written into a kth bit in B(0, 0)of La(0). Secondly, D(k−1, 1) is written into a kth bit in B(1, 0) ofLa(1). Thirdly, D(k−1, 2) is written into a kth bit in B(2, 0) of La(2).The same operation as referred to above is repeated and thereafterD(k−1, q−1) is written into a kth biting B(q−1, 0) of La(q−1) as theqth. Thus, the serial bits on the line of X=k−1 in the address map ofthe memory shown in FIG. 1 are written, by q bits.

While the write operation is being performed at the above bank-0, thebank-1 is ready for its writing.

Next, D(k−1, q) is written into a kth bit of B(q, 0) of La(q) in thebank-1 as the q+1th. The q+2th writing is as follows: D(k−1, q+1) iswritten into a kth bit of B(q+1, 0) of La(q+1). The same operation asdescribed above is repeated and thereafter D(k−1, 2q−1) is written intoa kth bit of B(2 q−1, 0) of La(2 q−1) as the 2 qth. As described above,serial bits on the line of X=k−1 in the address map of the memory shownin FIG. 5 are further written by q bits.

While the write operation at the above bank-1 is being performed, thebank-0 is ready for its writing.

The write operations described in the bank-0 and bank-1 are continuouslyperformed up to La(M−1) as indicated by arrows in FIG. 5. It is thuspossible to write the serial bits on the line of X=k−1 in the addressmap of the memory shown in FIG. 2 at high speed (provide a page accessin the row direction).

1-a-3) Description of an Access to a Line of X=k in the Address Map ofthe Memory Shown in FIG. 2:

As shown in FIG. 6, D(k, 0) is first written into the leading bit inB(0, 1) of Lb(0) in the bank-1. Secondly, D(k, 1) is written into theleading bit in B(1, 1) of Lb(1). Thirdly, D(k, 2) is written into theleading bit in B(2, 1) of Lb(2). The same operation as referred to aboveis repeated and thereafter D(k, q−1) is written into the leading bit inB(q−1, 1) of Lb(q−1) as the qth. Thus, the serial bits on the line ofX=0 in the address map of the memory shown in FIG. 5 are written by qbits.

While the write operation is being performed at the above bank-0, thebank-1 is ready for its writing.

Next, D(k, q) is written into the leading bit of B(q, 1) of Lb(q) in thebank-0 as the q+1th. The q+2th writing is as follows: D(k, q+1) iswritten into the leading bit of B(q+1, 1) of Lb(q+1). The same operationas described above is repeated and thereafter D(k, 2 q−1) is writteninto the leading bit of B(2 q−1, 1) of Lb(2 q−1) as the 2 qth. Thus,serial bits on the line of X=0 in the address map of the memory shown inFIG. 2 are further written by q bits.

While the write operation at the above bank-1 is being performed, thebank-0 is ready for its writing.

The write operations at the bank-0 and bank-1 are continuously performedup to Lb(M−1) as indicated by arrows in FIG. 6. It is thus possible towrite the serial bits on the line of X=0 in the address map of thememory shown in FIG. 5 at high speed (provide a page access in the rowdirection).

While the writing in FIG. 6 of serial bits on a line of X=k+1 in theaddress map of the memory shown in FIG. 2 is performed in a mannersimilar to the above operation, the present bit writing is differentfrom the above writing in that items of data D are written into secondbits of B(r, 1) (where r: arbitrary integers). The subsequent processingis performed in the same manner as described above up to 2kth bits.

1-b) Description of Reading Method:

The read operation can be performed in exactly the same manner as thewrite operation by reading data in the same order as is the casepreviously described in the write operation. Since another bank readingcalled “bank interleaving” can be set up during an access to one bank inparticular, a continuous high-speed serial access can be performed.

Thus, how to perform the reading and writing for the high-speed serialaccess in the row direction in the present invention has been describedin detail. Although the serial access has been started from the addressof Y=0 in the address map of the memory shown in FIG. 1 for convenienceof illustration, it is needless to say that the present access may bestarted from a given address.

2) Description of High-Speed Serial Access in Column Direction:

A description will be made of how to perform the high-speed serialaccess in the column direction according to the present invention. Theorder of a serial access in a column direction of Y=q in the address mapof the memory shown in FIG. 2 is shown in FIG. 7 on the track of arrowsas an illustrative example. The serial access can be started from agiven address. However, now consider where the access is made seriallyfrom X=0 in FIG. 2 for simplification. The access is similarly done evenin the case of the write and read operations. The access for the readoperation will be explained below.

First of all, according to the present invention, the leading access bitis equivalent to data D(0, q) of Y=q and X=0 in FIG. 2 and correspondsto the leading bit in B(q, 0) of La(q) in the bank-1. This D(0, Q) willfirst be read as the leading bit. Similarly, the next read data D(l, q)is equivalent to data positioned next to D(0, q) in B(q, 0) of La(q) inthe bank-1. This data is read as the second read data. Similarly, theread data D(2, q) after D(1, q) corresponds to data located next to D(1,q) in B(q, 0) of La(q) in the bank-1. Thus, since the leading bit to kthread data D(k−1, q) are serially arranged in B(q, 0) of La(q) in thebank-1, the total k bits in the column direction can be seriallyaccessed at high speed over the range of D(0, q) to D(k−1, q) inaccordance with a circuit operation similar to the page mode (high-speedserial access) in the row direction.

During the access in the bank-1, a preparation for an access to B(q, 1)in Lb(q) of the bank-0 is done. Described specifically, a word line inthe bank-0 corresponding to B(q, 1) is started up. Thus, the serialaccess is sequentially performed even upon switching from the bank-1 tothe bank-0.

The leading bit data of B(q, 1) in Lb(q) of the bank-0 corresponds toD(k, q) and is read following kth data as k+1th serial read data in thecolumn direction. In a manner similar to the access in the bank-1, thetotal k bits in the column direction can be serially accessed at highspeed over the range of D(k, q) to D(2 k−1, q). Namely, since the k+1thto 2kth read data D(2 k−1, q) are serially arranged in B(q, 1) of Lb(q)in the bank-0, the total k bits in the column direction can be seriallyaccessed at high speed over the range of D(k, q) to D(2 k−1, q) inaccordance with a circuit operation similar to the page mode (high-speedserial access) in the row direction.

During the access in the bank-0, a preparation for an access to B(q, 2)in La(q) of the bank-1 is performed. Described specifically, a word linein the bank-1 corresponding to B(q, 2) is started up. Thus, the serialaccess is sequentially performed even upon switching from the bank-0 tothe bank-1.

The quick serial read operation in the column direction can be carriedout by repeating the similar operations in the bank-0 and the bank-1subsequently as indicated by arrows in FIG. 7. In the memory deviceaccording to the present invention, the items of data in which theaddresses in the column direction are continuous, are arranged in therow direction and the items of data in which the addresses in the nextcolumn direction of the opposite bank are continuous, are ready fortheir accesses. Therefore, an intermission-free high-speed serial accesscan be implemented.

A specific embodiment will next be described by a simple example of 4×4blocks.

FIG. 8 is a diagram showing the correspondence of FIG. 1 and an exampleof a memory having a capacity of 512 bits. A drawing (corresponding toan example of a line access of X=0 in FIG. 2) corresponding to FIG. 4referred to above is shown in FIG. 9. Further, a drawing (correspondingto an example of a line access of X=4 in FIG. 2).is illustrated in FIG.10. Moreover, an example of a line access of X=8 in FIG. 2 and anexample of a line access of X=12 in FIG. 2 are shown in FIGS. 11 and 12respectively.

Since the serial accesses in the row directions are different from eachother in locations to be accessed in FIGS. 9 through 12 and similar inoperation to each other, the example shown in FIG. 9 will be explainedas a typical one.

D(0, 0) (which is specified by an X address 00000, and a Y address 0000)is first written into the leading bit in B(0, 0) of La(0) shown in FIGS.8 and 9. Secondly, D(0, 1) is written into the leading bit in B(1, 0) ofLa(1). Thirdly, D(0, 2) is written into the leading bit in B(2, 0) ofLa(2). Further, D(0, 3) is written into the leading bit in B(3, 0) ofLa(3) as the fourth. Serial bits on a line of X=00000 in an address mapof the memory shown in FIG. 8 are written by four bits in this way.

The bank-1 is ready for its writing during the above write operation inthe bank-0. Described specifically, a word line of X=10100 in the bank-1is started up.

D(0, 4) is written into the leading bit in B(4, 0) of La(4) as thefifth. As the sixth writing, D(0, 5) is written into the leading bit inB(5, 0) of La(5). The similar operation is repeated and thereafter D(0,7) is written into the leading bit in B(7, 0) of La(7) as the eighth.Thus, serial bits on the line of X=10100 in the address map of thememory shown in FIG. 8 are further written by four bits.

The bank-0 is ready for its writing during the above write operation inthe bank-1. Described specifically, a word line of X=01000 in the bank-0is started up.

Further, the write operations described in the bank-0 and bank-1 aresequentially performed till La(15) as indicated by arrows in FIG. 9. Itis thus possible to write the serial bits arranged in the row directionin the address map of the memory shown in FIG. 8 at high speed (providea page access in the row direction).

FIGS. 10 through 12 show the cases where X=4, X=8 and X=12,respectively. Since the operations shown in FIGS. 10 through 12 aresimilar to the operation shown in FIG. 9, the explanations are omitted.

The operation of serially accessing serial bits in a column direction bythe embodiment of FIG. 8 will next be described.

FIG. 13 shows an example of a line access of X=0 to X=15 in FIG. 8 atY=0 as an example of the serial access in the column direction. In FIG.13, all of the bits of Y=0 are located in the collections or sets ofLa(0) The serial access is started from the leading bit D(0, 0) in B(0,0) of La(0) in a bank-0 and made up to D(3, 0) in accordance with arrowsin FIG. 13. As indicated by an arrow a in FIG. 13, D(4, 0) in B(0, 1) ofLb(0) in a bank-1 is accessed. After the access has been made up to D(7,0), D(8, 0) in B(0, 4) of La(0) is continuously accessed in accordancewith an arrow b in FIG. 13. In accordance with the similar operationssubsequently, the serial access is sequentially performed to reach D(15,0).

Since the bank-0 and the bank-1 are alternately accessed even in thecase of the serial access in the column direction, a high-speed accesscan be achieved as in the case of the high-speed access to the serialbits in the row direction.

A circuit of a semiconductor memory device according to the invention ofthe present application will next be explained.

FIG. 14 is a circuit diagram showing a first embodiment of thesemiconductor memory device according to the present invention.

In a memory bank-0 and a memory bank-1, a plurality of memory cell unitsQij (where i=l through n and j=l through m: these will be omittedsubsequently) each comprising a memory capacitor and a transistor areelectrically connected to bit line pairs BLi and BLi/. The bit linepairs BLi and BLi/ are respectively electrically connected to senseamplifiers SAi and opening/closing transistors Trai and TraVrespectively electrically connected to data bus pairs. Respective onesof the bit line pairs constitute column units Ci.

Each of the memory bank-0 and the memory bank-1 comprises an X decoder Afor selecting an arbitrary word line WLj electrically connected to anyof the memory cell units Qij in response to an X address XA generatedfrom an address generator D, a Y decoder B for selecting an arbitrarycolumn unit Ci in response to an Y address YA generated from the addressgenerator D, and a plurality of column unit groups.

An input/output circuit E having an I/O terminal is electricallyconnected to the data bus pairs so as to perform a common input/outputoperation between the bank-0 and the bank-1.

An address ADD is inputted to an address converting or translator F forperforming address conversion employed in the present invention alreadydescribed in detail. The address converting circuit F inputs a convertedaddress to the address generator D. A clock signal CLK, a check selectsignal CS/, a row address strobe signal RAS/, a column address strobesignal CAS/, a write enable signal WE/, a bank select signal BS (handledin the same manner as the address) and an input address signal ADD areinputted to a control signal generator I. The control signal generator Igenerates signals for controlling all the memory operations startingwith the address generator D and the input/output circuit E. Thedetailed description of the signals will be omitted in the presentembodiment.

The operation of the circuit of the first embodiment will next bedescribed.

FIG. 15 is a diagram for describing the operation of the circuit of thefirst embodiment shown in FIG. 14. How to output data on different wordlines by alternately using the two banks will be explained with times.

Time t0:

Since RAS/ and CS/ are low in level, ADD at the time of the leading edgeof CLK is captured as an X address Xi in synchronism with the leadingedge of CLK. Since BS is low in level at this time, a word line WL0 i ofthe bank-0 is started up.

Time t1:

Since CAS/ and CS/ are low in level, ADD at the time of the leading edgeof CLK is captured as a Y address Yi in synchronism with the leadingedge of CLK, so that a column line Y0 i of the bank-0 is selected.

Time t2:

Data D0 i in a memory cell unit selected by WL0 i and Y0 i is outputtedfrom I/O through a data bus G.

Time t3:

Since RAS/ and CS/ are low in level, ADD at the time of the leading edgeof CLK is captured as an X address Xi in synchronism with the leadingedge of CLK. Since BS is high in level at this time, a word line WLli ofthe bank-1 is started up. An access to the word line WLli is performedat time t6 or later.

At this time, data D0 i+1 in a memory cell unit selected by a columnline Y0 i+1 in synchronism with the leading edge of CLK is transferredto an I/O circuit G through the data bus G and outputted from I/O.

Time t4:

Data D0 i+2 in a memory cell unit selected by a column line Y0 i+2 insynchronism with the leading edge of CLK is outputted from I/O throughthe data bus G.

Assuming at this time that RAS/ and CS/ are low in level and CAS/ ishigh in level, and one address (such as A8 or the like, and when A8 islow in level, the bank-0 enters into a precharge mode, whereas when A8is high in level, the bank-1 is brought to the precharge mode)previously defined specifically to the device to set the bank to a givenone-side precharge mode is low in level although not shown in thedrawing in particular, the activated and selected word line WL0 i of thebank-0 results in a low level.

Time t5

Since RAS/ is high in level and CAS/ and CS/ are low in level, ADD atthe time of the leading edge of CLK is captured as a Y address Yi insynchronism with the leading edge of CLK and thereby a column line Yliof the bank-1 is selected.

At the same time, data D0 i+3 in a memory cell unit selected by a columnline Y0 i+3 in synchronism with the leading edge of CLK is outputtedfrom I/O through the data bus G.

Time t6:

Data D1 i in a memory unit selected by the word line WL1 i selected attime t3 and the column line Y1 i selected at time t5 is transferred tothe I/O circuit G through the data bus G and outputted from I/O.

FIG. 16 is a diagram showing a circuit example of an address translatoron the assumption that the configuration of each individual bankemployed in the first embodiment is taken as the example of 4×4 blocksin FIG. 8. The use of the address converter circuit makes it easy toperform address translation employed in the first embodiment of thepresent invention.

Thus, the first embodiment of the present invention is capable of easilyperforming address translation for allowing the previously-impracticablehigh-speed serial access in the column direction, on the memory at highspeed as well as performing the high-speed serial access in the rowdirection.

FIG. 17 is a circuit diagram showing a second embodiment of asemiconductor memory device according to the present invention.

In the second embodiment, an address translator switching circuit G forreceiving an address translator switch signal P therein is added to thefirst embodiment. The address translator switching circuit G controls anaddress translator F.

FIG. 18 is a circuit diagram collectively showing the address translatorswitching circuit and the address translator employed in the secondembodiment. When the address translator switch signal P is low in level,input addresses ADD (X0, X1, X2, X3, X4, Y0, Y1, Y2 and Y3) result ininternal addresses as they are. However, when the address translatorswitch signal P is high in level, the input addresses are placed underthe control of the address translator illustrated in FIG. 17, which iscapable of implementing the present invention.

Similarly to the first embodiment, the second embodiment is capable ofeasily performing address translation for allowing thepreviously-impracticable high-speed serial access in the columndirection, on the memory at high speed as well as being capable ofperforming the high-speed serial access in the row direction. Further,when the address translator switch signal P is low in level, the secondembodiment can provide memory mapping as a memory similar to one used inthe prior art.

After the completion of the address translation, switching to addressgeneration is done to convert the input addresses into desired ones.Since data written by the address translation can be outputted in a pagemode in the row direction, a block access can be performed with lesspower consumption.

FIG. 19 is a circuit diagram showing a third embodiment of asemiconductor memory device according to the present invention.

In the third embodiment as shown in FIG. 19, a special serial Y addressgenerator DY is provided to input a special serial Y address SYA to a Yaddress decoder B. The special serial Y address generator DY is suppliedwith signals PL and PS. A control signal generator is supplied with amode switch signal T/Y for the special serial Y address generator.

FIG. 20 is a diagram showing a special serial Y address generator shownin FIG. 19.

Ci (where i=0 to n−1) respectively indicate counter element circuitswhich constitute address counters for generating serial addresses.

FIG. 21 is a timing chart for describing the operation of the specialserial Y address generator. Let's now assume that input addresses Y0through Yn−1 are all low in level. The operation of the special serial Yaddress generator will be explained with time.

Time t0:

The signal PL becomes a high level so that transistors Trd0 throughTrdn−1 are turned on. Thus, the input addresses are taken in theircorresponding counter element circuits C0 through Cb−1. Y addresses SY0through SYn−1 are outputted as the input addresses as they are and allrendered low in level. Since the signal PS is high in level at this time(controlled by the mode switch signal TN), transistors Tra0 throughTrai−1 are turned off, a transistor Tre is also turned off and atransistor Trf is turned on.

Time t1:

Since the PS is high in level even if a clock signal CLK rises, thetransistors Tra0 through Trai−1 are turned off and the clock signal CLKis not inputted to the counter element circuits C0 through Ci−1. Thus,the Y addresses SY0 through SYi−1 remain low in level. On the otherhand, since the signal PS is high in level and the transistor Trf is inan on condition, a node a of the counter element circuit Ci results in aground level. Thus, the output SYi of the counter element circuit Ci isbrought to a high level in response to the leading edge of the clocksignal CLK. Further, the high-order Y addresses SYi+1, SYi+2, . . .remain low in level.

Time t2:

At the next clock, the Y address SYi goes low and the Y address SYi+1goes high.

Up to time t3:

As shown in FIG. 24, the counter element circuits Ci through Cn−1 serveas address counters respectively and the Y addresses SYi through SYn−1indicative of their outputs are generated as serial addresses insynchronism with the leading edge of the clock signal CLK. Since thesignal PS is high in level, the counter element circuits C0 through Ci−1are not supplied with the clock signal CLK and thereby their outputsremain unchanged.

Time t3:

The signal PL goes high in level so that the transistors Trd0 throughTrdn−1 are turned on. Thus, the input addresses are brought into thecounter element circuits C0 through Cb−1. The Y addresses SY0 throughSYn−1 are outputted as the input addresses as they are and all of themgo low in level. Immediately after such a state, the signal PS isrendered low in level. At this time, the transistors Tra0 through Trai−1are turned on, the transistor Tre is also turned on and the transistorTrf is turned off. At this time, the counter element circuits C0 throughCn−1 serve as a series of address counters.

Subsequent to time t4:

Under the same operation as that taken up to time t0 to time t3, thecounter element circuits C0 through Cn−1 function as a series of addresscounters for counting up the clock signal CLK to thereby generateincremental addresses as shown in FIG. 21.

In regard to how to write data into and read same from the memoryaccording to the third embodiment, the serial access operation of the Ydecoder is classified into two types. One of the two types correspondsto a case in which when a serial access in a row direction is performed,the least significant address of high-order addresses serves as if towork as an Y address “0” while the low-order Y addresses shown in FIGS.4 through 6 are being fixed, and the high-order addresses areincremented for the clock signal. On the other hand, another one thereofcorresponds to a case in which when a serial access in a columndirection is done, the least significant Y address “0” to the mostsignificant Y address serve as a series of counters as in the case ofthe execution of the serial access shown in FIG. 7.

The addresses may be generated outside to execute the serial access. Itis however necessary to provide an address generator capable ofperforming a higher-speed serial access. The special serial Y addressgenerator shown in FIG. 20 may be used for the aforementioned two typesof high-speed serial Y address generations.

Namely, when the signal PS is high in level as indicated at time t0 tot3 in FIG. 21, the low-order Y addresses are kept at their levels asthey are even if the clock signal CLK is inputted (while the low-order Yaddresses inputted as the initial values are all low in level in thepresent embodiment, any address may be inputted as the initial values inpractice). In the high-order Y address counters, the high-order Yaddresses serve so as to generate serial addresses incremental for theclock signal CLK as if the counter element circuits Ci were brought tothe least significant address counters, whereby the Y decoder operationsshown in FIGS. 4 through 6 are allowed.

When the signal PS is low in level as indicated at time t3 or later inFIG. 21, an incremental serial address is generated with C0 as the leastsignificant Y address counter, so that the serial access shown in FIG. 7can be performed.

Thus, since the special serial Y address generator is provided in thethird embodiment, the higher-speed serial access in the row directionand the similar-speed serial access in the column direction can beperformed.

FIG. 22 is a circuit diagram showing a fourth embodiment of asemiconductor memory device according to the present invention.

The fourth embodiment shows one in which the address translatorswitching circuit F illustrated in the second embodiment is added to thethird embodiment.

While a high-speed serial access in a row direction can be performed inthe fourth embodiment, address translation for allowing thepreviously-impracticable high-speed serial access in the columndirection can be easily performed on a memory at high speed and theconventional addresses are generated to enable a memory access.Therefore, the semiconductor memory device according to the presentembodiment can perform memory mapping as the conventional memory.

After the completion of the address translation, switching to addressgeneration is done to convert input addresses into desired ones. Sincedata written by the address translation can be outputted in a page modein the row direction, a block access can be performed with less powerconsumption.

Further, since a special serial Y address generator is provided, ahigher-speed row-direction serial access and a similar-speedcolumn-direction serial access can be achieved.

Although the method of arranging the data in the two bank memory having4×4 blocks per bank, according to the first embodiment of the presentinvention is illustrated in simplified form, a method of re-arrangingmemory data on the same X addresses as those shown in FIG. 8 in just thesame idea will be illustrated as the method according to the secondembodiment of the present invention.

FIG. 26 is a diagram showing the method according to the secondembodiment of the present invention as an example of 4×4 blocks.

The method according to the second embodiment can obtain substantiallythe same advantageous effects (capable of implementing a high-speedserial access in a row direction and a high-speed serial access in acolumn direction) as those obtained by the method according to the firstembodiment.

Namely, data on the same X addresses as those in the memory shown inFIG. 8 are re-arranged in the order of reducing or decreasing Xaddresses (i of D(i, j)) of data as a collection or set of data havingcontinuous Y addresses as shown in FIG. 23. A description will be madeof an example of X=0 in FIG. 23. Namely, items of data are re-arrangedin the order of D(0, 0), D(0, 1), D(0, 2), D(0, 3), D(1, 0), D(1, 1),D(1, 2), . . . .

The serial access (row page access) in the row direction will next beexplained with reference to FIGS. 24 and 25.

FIG. 24 shows the order of serially accessing bits on a line of X=0 inthe address map of the memory shown in FIG. 23. The leading bit to beserially accessed will be defined as D(0, 0). An access to the leadingbit D(0, 0) in C(0, 0) of Ma(0) is started and data having continuous Yaddresses in C(0, 0) are successively accessed. During that time, abank-1 is ready for a continuous access following the selection of aword line of X=4 in the bank-1.

After the completion of the access to D(0, 3), D(0, 4) in C(0, 1) ofMa(4) is accessed. Further, data having continuous Y addresses in C(0,1) are successively accessed. During that time, the bank-0 is ready fora continuous access following the selection of a word line of X=8 in thebank-0.

Carrying out the above operations in accordance with arrows shown inFIG. 24 makes it possible to serially access D(0, 0) to D(0, 15) in therow direction of X=0 in FIG. 23. FIG. 25 shows an example in which D(4,0) to D(4, 15) are serially accessed in the row direction of X=4 in FIG.23.

FIG. 26 is a diagram showing a method of executing a serial access in acolumn direction of Y=0 in FIG. 23.

D(0, 0) through D(3, 0) of Ma(0) through Ma(3) in a bank-0 are accessedin order of arrows. During that time, X addresses and a row of X=0 in abank-1 are activated to make preparations for the following serialaccess.

After the completion of the access to D(3, 0), D(4, 0) through D(7, 0)of Mb(0) through Mb(3) in the bank-1 are accessed in order of arrows.During that time, X addresses and a row of X=1 in the bank-0 areactivated to make preparations for the following serial access.

The implementation of the above operations in accordance with arrowsshown in FIG. 26 allows a serial access to D(0, 0) to D(31, 0) in thecolumn direction of Y=0 in FIG. 23.

As has been described above in detail, the semiconductor memory deviceaccording to the present invention, the method of reading the data fromand writing same to the semiconductor memory device and the high-speedserial access in the row direction can be achieved. Further, the addresstranslation for allowing the conventionally-impracticable high-speedserial access in the column direction can be easily effected on thememory at high speed.

While the present invention has been described with reference to theillustrative embodiments, this description is not intended tubeconstrued in a limiting sense. Various modifications of the illustrativeembodiments, as well as other embodiments of the invention, will beapparent to those skilled in the art on reference to this description.It is therefore contemplated that the appended claims win cover any suchmodifications or embodiments as fall within the true scope of theinvention.

1-8. (canceled)
 9. A method of accessing matrix data comprising:providing matrix data having a plurality of serial line data sets;providing a memory device having a plurality of banks each of which hasa plurality of memory cells respectively connected to a plurality of bitlines; grouping the memory cells into a plurality of memory blocks eachof which including n memory cells so that m memory blocks are connectedto each of the bit lines, wherein m and n are natural numbers; andserially accessing the memory cells within one of the memory blocks inone of the memory banks and then serially accessing the memory cellswithin another one of the memory blocks in another one of the memorybanks, alternatively so that the accessed memory cells correspond to theserial line data sets of the matrix data.
 10. A method of accessingmatrix data according to claim 9, wherein after said serially accessingone of the memory blocks and the another one of the memory blocks,serially accessing other memory blocks next to the one of the memoryblocks and the another one of the memory blocks.
 11. A method ofaccessing matrix data according to claim 10, wherein the another one ofthe memory banks prepares for accessing during accessing of the one ofthe memory banks.